Conforming Vapor Chamber (CVC)
TPT's flagship product is its under-development conforming vapor chamber. Existing vapor chambers rely on thermal interface materials (TIMs) (such as grease, paste, or elastomers) to bridge gaps between circuit board components and the vapor chamber. This results in an increase in thermal resistance which decreases cooling efficiency.
Our solution is to increase contact between the vapor chamber and circuit board components by designing vapor chambers with compliant protrusions that account for different stack up heights.
These protrusions move to account for small variability between identical circuit board designs that occur due to manufacturing tolerances and thermal expansion during usage. This can decrease cost to circuit board manufacturers as it allows for a wider range of acceptable height tolerances without significant differences in thermal performance.